EbixONE (E1) is Ebix's global AI initiative that unifies every Ebix vertical and offerings. It covers trusted data, AI-ready integrations, and the governance layer. Every new AI capability from Ebix ...
The modular PC maker will now charge $10 per GB for its 8GB, 16GB, and 32GB DDR5 RAM modules. The modular PC maker will now charge $10 per GB for its 8GB, 16GB, and 32GB DDR5 RAM modules. is a news ...
A malicious package in the Node Package Manager (NPM) registry poses as a legitimate WhatsApp Web API library to steal WhatsApp messages, collect contacts, and gain access to the account. A fork of ...
The U.S. Department of Transportation (DOT) has released two closely linked policy documents that establish the federal government’s first comprehensive framework for integrating advanced air mobility ...
Shopify powers more than 6 million live ecommerce websites, supported by a robust app ecosystem that can extend nearly every part of the customer journey. Anyone can develop an app to perform ...
During a speech before key players in the defense industrial base on Friday, November 7, Secretary Hegseth announced plans for a sweeping transformation of the Defense Acquisition System, ...
We collaborate with the world's leading lawyers to deliver news tailored for you. Sign Up for any (or all) of our 25+ Newsletters. Some states have laws and ethical rules regarding solicitation and ...
COOEC has begun shipping 13 massive topsides modules to Hanwha Ocean's South Korea yard for integration with the P-79 FPSO, destined for Brazil’s Buzios oilfield Chinese contractor Offshore Oil ...
GLI Gaming Security Framework Module 3 (GLI-GSF-3) v1.0: Gaming Information Security (GIS) Controls Audit - Vendor Controls GLI Gaming Security Framework Module 4 (GLI-GSF-4) v1.0: Gaming Information ...
OpenAI unveiled new API updates at its Dev Day on Monday, introducing GPT-5 Pro, its latest language model, its new video generation model Sora 2, and a smaller, cheaper voice model. The addition of ...
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Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...
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