Artificial intelligence is creating a growing memory bottleneck, with Bernstein analysts saying demand is spreading beyond high-bandwidth memory into conventional DRAM, NAND flash and storage.
For most of this year, we've followed the cash down the stack into chips, memory, networking and power. This week, we're ...
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Samsung and SK Hynix unveiled stacked memory chips built to break the AI data bottleneck
Samsung Electronics and SK Hynix used this year’s Future of Memory and Storage conference in Santa Clara to lay out competing ...
Samsung Electronics showcased its next-generation 3D memory architectures at the Future of Memory and Storage 2026 in California on Tuesday ...
Use left and right arrow keys to seek audio. SK hynix CEO Kwak Noh-Jung has just announced the company's new vision of its "Full Stack AI Memory Creator" at the SK AI Summit 2025 event, hosted in ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
Use left and right arrow keys to seek audio. Rambus has provided more details on its upcoming HBM4 memory controller, which offers some huge upgrades over current HBM3 and HBM3 memory controllers.
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