Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
Innodisk has launched its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI ...
At Embedded World 2025, Silex reveals the AMC Edge System-on-Module, EP-200Q, a compact, high-performance Wi-Fi 7 SoM for flexible, power-efficient connectivity for industrial AI applications. The AMC ...
Innodisk is targeting the growing edge AI market through a joint development with Qualcomm, introducing an 'AI on Dragonwing' ...
The LEC-RB5 SMARC is a high-performance module, built with the Qualcomm® QRB5165 processor, allowing on-device AI and 5G connectivity capabilities for consumer, enterprise, and industrial robots. It ...
VANCOUVER, British Columbia, Oct. 10, 2019 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX: ITC and OTCQX: ISYRF) (“Intrinsyc” or the “Company”), a leading provider of solutions for the ...
Quectel Wireless Solutions, a global supplier of internet of things (IoT) modules, has launched the EG18, an LTE Category 18, high-speed module that offers 1.2Gbps downlink and 150Mbps uplink peak ...
After announcing the high-end Snapdragon X2 Elite Extreme and X2 Elite processors last year, Qualcomm has now introduced the ...
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